Open Call

Jan van Eyck Call for Applications 2027

Jan van Eyck Academie

With Funding
Maastricht, Netherlands

Eligibility

Participants are expected to settle in Maastricht during their residency period; The languages of communication at the academy are Dutch and English. It is important to master the English language sufficiently to be able to converse and collaborate with fellow participants and staff members; Alumni of Rijksakademie or De Ateliers, two fellow Post-Academies in the Netherlands, are not eligible if they have been enrolled as full-time participants in the named institutions; The Jan van Eyck Academie is formally not an educational institute. Consequently, the participant cannot earn any ECTS and the institute does not provide degrees or certificates.

Number of Participants

The Jan van Eyck residency are looking for individual practitioners, duos, and collectives collectives as well as candidates with child(ren) are welcome to apply. 30 to 32 positions are selected through this general call.

Deadline

Selection Results (Announcement Dates)

Duration

January 15, 2027 - December 15, 2027

Funding

  • €2,000.00 material budget (one-time)
  • €1,500.00 stipend (monthly)

Costs

  • €65.00 application fee
  • €2,750.00 program fee (one-time)

Facilities

Darkroom, Individual Studio, Print Shop, Wood Shop

Housing

Apartment

Meals

Lunch

Languages

Dutch, English

Program Description

Artists and designers coming from all fields, architects, curators, writers, and other artistic researchers, (literary) writers, and critical thinkers, including duos and collectives, are invited to apply for the residency programme taking place in 2027 at the Jan van Eyck Academie. Each selected participant receives the time and space to expand their artistic practice with the expert support of our advisers, the curator/resident liaison, the departments of Nature Research and Education & Development, as well as the library and the Jan van Eyck labs – Photography & Audiovisual, Material Matters, Food, Printing & Publishing, and Future Materials.

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